专利名称：Printed circuit board and method for
fabricating the same
发明人：Hsien-Chieh Lin,Tung-Yu Chang申请号：US12956724申请日：20101130公开号：US08420954B2公开日：20130416
专利附图：
摘要：The invention provides a printed circuit board and a method for fabricating thesame. The printed circuit board includes a core substrate having a first surface and anopposite second surface. A first through hole and a second through hole are formed
through a portion of the core substrate, respectively from the first surface and secondsurfaces, wherein the first and second through holes are laminated vertically and connectto each other. A first guide rail and a second guide rail are, respectively, formed througha portion of the core substrate and connected to the second through hole, so that a fluidflows sequentially from an outside of the printed circuit board through the first guiderail, the second through hole and the second guide rail, to the outside of the printedcircuit board.
申请人：Hsien-Chieh Lin,Tung-Yu Chang
地址：Taoyuan County TW,Taoyuan County TW
国籍：TW,TW
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