Compact design relay

专利名称：Compact design relay发明人：Teizo, Fujita申请号：EP81303143.2申请日：19810709公开号：EP0053870A1公开日：19820616

专利附图：

摘要：In a compact design relay, in which gaps between a base member (2) and a casemember (3) covering the base member and between the base member (2) and terminalpins (1) mounted on the base member are sealed by filing the gaps with an adhesive (4)which is thermally hardened thereafter, a small air vent hole (5) is formed in part of the

case member (3) and/or base member (2) free from the adhesive (4) and is sealed with afurther adhesive (8) after the thermal hardening treatment of the first-mentionedadhesive (4).

申请人：IZUMI DENKI CORPORATION

地址：10-40, Mikunihonmachi-1-chome Yodogawa-ku Osaka JP

国籍：JP

代理机构：Miller, Joseph

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