专利名称：Method for aligning the bondhead of a Die
Bonder
发明人：Stefan Behler申请号：US10937991申请日：20040910公开号：US07066373B2公开日：20060627
专利附图：
摘要：In order to eliminate the inclination of a semiconductor chip picked by a gripper,the height of at least three points on the underneath of the semiconductor chip isdetermined in relation to a reference surface and from this the inclination is calculated.
Determining the heights takes place in that the semiconductor chip is lowered until thesemiconductor chip comes into contact with a needle.
申请人：Stefan Behler
地址：Steinhausen CH
国籍：CH
代理机构：Thelen Reid & Priest LLP
代理人：David B. Ritchie
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