Electrical coupling between chamber parts in elect

专利名称：Electrical coupling between chamber parts

in electronic device processing equipment

发明人：Martin A. Kent,Abron Toure,Stephen N.

Golovato

申请号：US09789575申请日：20010222

公开号：US20010035132A1公开日：20011101

摘要：An electrical coupling is provided between chamber parts of electronic deviceprocessing equipment (e.g., equipment used for processing semiconductor wafers) toreduce differences in the electrical potential between such parts. The coupling preventsor at least reduces the presence of plasma or excited gases in undesired regions of theprocess chamber. In illustrated embodiments, the coupling extends from a cover of avertically movable electrode assembly to the liner of the chamber wall. Although theseparts are each respectively coupled to ground, it is believed that differences in theground path impedances result in these parts having different electrical potentials, andthe potential differences can cause plasma or excited gases to be present in undesirableregions of the chamber. These electrical potential differences are suppressed byelectrically coupling the parts to thereby prevent or reduce the presence of plasma orexcited gases in undesired regions of the chamber. Although in the illustrated

embodiments the cover of the electrode assembly is coupled to the chamber liner, thecoupling could be utilized to suppress potential differences between other chamberparts.

申请人：TOKYO ELECTRON LIMITED

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